Technology

High performance (95000CPH) and exact placement platform equipped with five mounting robots and pick & place heads:

• 2x V12 Head: 12 nozzle chip shooter with mounting speed up to 26000CPH. Supported components are up to 5.0×5.0 mm (7.6 mm diagonal), or 7.5×7.5 mm while using 6 nozzles. Component height is 3 mm on-the-fly
• DynaHead: versatile high-speed placing head. Depending on the size of placed components during production Dyna is able to switch between the mounting head for the 12 nozzle chip-shooter (25000CPH), 4 nozzle placer (11000CPH) and Pick & Place (5000CPH). Replacement time is 3 seconds
• H08M Head: this head can pick up 8 components at once up to 13 mm with speed up to 14000CPH
• H01 Head: the Pick n’Place head for components up to 25.4 mm height with mounting speed up to 4200CPH
• It has a large capacity of components (feeders): in order to do this there are 225 places available for 8 mm feeders
• Support of a wide range of DPS sizes: NXT III supports small PCBs from 48 x 48 mm up to large DPS of 610 x 610 mm

High performance (74000CPH) and exact placement platform equipped with four mounting robots and pick & place heads:

• 2x H12HS Head: 12 nozzle chip shooter with mounting speed up to 26000CPH. Supported components are up to 5.0×5.0 mm (7.6 mm diagonal), or 7.5×7.5 mm while using 6 nozzles. Component height is 3 mm on-the-fly
• DynaHead: versatile high-speed placing head. Depending on the size of placed components during production Dyna is able to switch between the mounting head for the 12 nozzle chip-shooter (25000CPH), 4 nozzle placer (11000CPH) and Pick & Place (5000CPH). Replacement time is 3 seconds
• H01 Head: the Pick n’Place head for components up to 25.4 mm height with mounting speed up to 4200CPH
• It has a large capacity of components (feeders): In order to do this there are 180 places available for 8 mm feeders. By using HEXA feeders it is also possible to increase the capacity to 264 8 mm places
• Support of a wide range of DPS sizes: AIMEX II supports small PCBs from 48 x 48 mm up to large DPS of 759 x 686 mm
• Support for components up to 38.1 mm high: Components 38.1 mm (1.5 inches)

High performance (50000CPH) and exact placement platform equipped with two mounting robots and pick & place heads:

• V12 Head: 12 nozzle chip shooter with mounting speed up to 26000CPH. Supported components are up to 5.0×5.0 mm (7.6 mm diagonal), or 7.5×7.5 mm while using 6 nozzles. Component height is 3 mm on-the-fly.
• DynaHead: versatile high-speed placing head. Depending on the size of placed components during production Dyna is able to switch between the mounting head for the 12 nozzle chip-shooter (25000CPH), 4 nozzle placer (11000CPH) and Pick & Place (5000CPH). Replacement time is 3 seconds.
• It has a large capacity of components (feeders): In order to do this there are 180 places available for 8 mm feeders. By using HEXA feeders it is also possible to increase the capacity to 264 8 mm places.
• Support of a wide range of DPS sizes: AIMEX II supports small PCBs from 48 x 48 mm up to large DPS of 759 x 686 mm
• Support for components up to 38.1 mm high: Components 38.1 mm (1.5 inches)

This reliable, high-performance and flexible mounter for SMT is particularly suitable for high-speed mounting of ultra-small and ultra-thin chips and small types QFPs, CSPs and BGAs, as well as of big QFPs, BGAs and special mechanical components.

• A six times larger mounting head with a new laser centering (LN60) for 6 nozzles (6 components are simultaneously centered, so called on-the-fly)
• One highly precise optical mounting head (IC) for the mounting of all types of QFPs, BGAs or CSPs and large mechanical components
• The dimensions of printed circuit boards from 50×30 mm to 410×360 mm; from 0.4 to 4 mm wide
• Number of feeders: maximum 80 pcs / 8 mm + 20 pallets
• Component size: 01005 (inches) up to 74×74 mm or 50×150 mm, height 0.2 – 25 mm
• Placement rate 15 400 cph according to IPC 9850 for laser centering
• Placement rate 4 600 cph according to IPC 9850 for vision centering (MNVC)

3D SPI Koh-Young 8030-2 is a reliable 3D equipment for applied solder paste inspection.

• High-performance 3D testing equipment for solder paste inspection
• Inline configuration
• Resolution 15/20/25 µm
• 3D shadow free moiré
• 2 moiré projection
• 4MPx camera
• Color image processing based on separated RGB components
• Inspection speed 0.45 sec/ shot

Fast fully 3D In-line AOI, working almost without false errors.

• Very fast programming and debugging – suitable for prototyping
• Inspection is not implemented by image processing like with 2D, but using the 3D measurement
• Height measurement resolution 1 µm
• 8 x moiré projections for fully eliminating shadows of tall components
• 4 MPix camera, 20 µm lens, possibility of measuring chips from the size 01005
• Inspection of all common faults, including BGA coplanarity or connectors
• 100% detection of the protruding pins of fine pitch components

Automatic screen printing – fully automatic screen printer Horizon 03i from DEK for quality and precise printing of solder paste. The screen printer is equipped with HawkEye® function that optically checks the printed paste on the PCB. Due to its speed, it is possible to check up to 100% of PCB area.

• Maximum PCB size 450×450 mm
• Optical control of printed paste on the PCB

Automatic screen printing – fully automatic screen printer Horizon 03 from DEK for quality and precise printing of solder paste.

• Maximum PCB size 450×450 mm

The unit is designed to accurately mark PCBs within a production line. A “flying laser” concept is used so that the CO2 laser is moved using servo controlled X-Y axis.

• The dimensions of printed circuit boards from 80×65 mm to 508×460 mm
• CCD camera for readability check
• Inline version
• CO₂ Laser
• Capability to mark text, barcodes and 2D codes
• Double-sided marking using integrated inverter

Asymtek Select Coat® 940 conformal coating machine is designed for the highest quality and productivity of automated coating processes. Fluids and air pressure are monitored through software-controlled electronic regulators.

• High-speed
• High-accuracy coating systems with integrated, closed-loop process control
• Process parameters are recorded
• Maximum PCB size is 421×400 mm

RHEM VXC Nitro 2450 523 is a high-performance Reflow-Convection-Soldering System with nitrogen atmosphere.

• Stable process
• Optimum heat transfer
• Optional adjustment of feed speed
• User-friendly software
• Nitrogen atmosphere
• Water cooling zones

The HOTFLOW 3/14e is a high-quality model of the Ersa HOTFLOW reflow system, that delivers exceptional soldering results due to its superior thermal performance, low transverse profile and its excellent zone separation.

• Modern, efficient convection oven used mainly for lead-free soldering
• 9 zones: 5 preheating zones, 2 soldering zones and 2 cooling zones
• Optional feed speed
• Creation and control of soldering profiles by wireless profilometer
• Max. PCB width 500 mm

SMT Reflow Oven for lead-free soldering in nitrogen atmosphere.

• 7 soldering zones + 1 cooling zone
• Possibility of creating a precise temperature profile precisely according to customer requirements and printing the temperature chart
• Max. PCB width 530 mm

Convection oven used for drying PCBs after coating.

• 4 soldering zones
• Optional adjustment of feed speed
• Max. PCB width 400 mm

MYCRONIC (MYDATA) SMD TOWER is a flexible automated storage system of reels and JEDEC trays with short retrieval time.

• Max. capacity of reels:  up to 658 pcs (Type 2000), 490 pcs (Type 5130), 980 pcs (Type 6150-15)
• For 8-44 mm (max. 15″) reels and JEDEC Tray
• Controlled atmosphere – maintaining the residual humidity (RH) up to 3.5% allows the storage of MSD components without re-vacuuming
• There is an alarm function for MSD components left outside a kempt environment and automatically releasing a new reel
• Possibility of monitoring the expiration of stored components with alarm function
• Instant real overview of the actual material stock
• By pressing one button the storage system will give you all necessary materials “handheld”

MP DRY CABINET is a drying cabinet (also referred to as super / ultra dry cabinet), developed to meet all customer requirements with the best possible parameters.

• Ideal for storing of PCBs and all MSD level components without repacking MBB bags …
• MP Dry Cabinets are manufactured according to IPC/ JEDEC J-STD 033C standard (storage of moisture-sensitive components)
• Accurate sensor, accuracy of +/-0.8% RH ( resp. +/-0.5%RH)
• Full graphic touchscreen
• Open door acoustic alarm, alarm time is defined by the user
• LAN connection with data acquisition possibility via network

Ersa EWS 330 is a fully-automatic high performance universal soldering system with frame conveyor and double wave, used for the professional soldering of through-hole components and mixed boards operated with lead-free solders in nitrogen atmosphere.

• Spray fluxer
• Shortwave, medium wave and dynamic preheating
• Optional adjustment of feed speed
• Max. PCB width 330 mm
• Double soldering wave
• N2-solder bath cover

The system is intended for cleaning metal stencils or frames polluted with solder paste or glue up to size 29”x32”.

• Maximum stencil size 820 x 90 x 740 mm
• Washing of stencils thinner than 100 microns

Powerful, hybrid, automatic rework station. Picking, centering and placing of components is performed automatically using a movable arm with a nozzle. The advantage is easy and precise control of the melting process with adjustable soldering profiles.

• Bottom pre-heater max. 5000 W
• Hot-air nozzles power 300 W, up to 32 l/s
• Max. PCB dimensions 5000×6000 mm